www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet 201 6 .0 3 - rev. c sml-d14(a) series 6/8 l precaution (surface mount device) 1.storage if the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use the product following the conditions: ? using conditions classification temperature humidity expiration date remark before using 5 to 30oc 30 to 70%rh within 1 year from receiving storage with waterproof package after opening package 5 to 30oc below 70%rh within 168h please storing in the airtight container with our desiccant (silica gel) ? baking bake the product in case of below: t he expiration date is passed. the color of indicator (silica gel) turned from blue to colorless or from green to pink. (even if the product is within the expiration date.) ? baking conditions temperature time humidity 60 3oc 12 to 24h below 20%rh remark ? bake products in reel. ? reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. ? recommend bake once. 2.application methods 2-1. precaution for drive system and off mode design the circuit without the electric load exceed ing the absolute maximum rating that applies on the products. if drive by constant voltage, it may caus e current deviation of the led and result in deviat ion of luminous intensity, so we recommend to drive by con stant current. (deviation of vf value will cause de viation of current in led.) furthermore, for off mode, please do not apply voltage neither forward nor reverse. e specially, for the products with the ag-paste used in the die bonding, there s high possibility to cause electro migration and result in function failure. 2 -2. operation life span there s p ossibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corr osive gases), please call our sales staffs for inqu iries about the concerned application below. longtime intensity of light life on mode all the time 2-3.applied stress on product the top of the led is very soft, which the silicon resin is used as sealing resin. therefore, please p ay attention to the overstress on it which may influence its rel iability. 2-4.usage the pro duct is led. we are not responsible for the usage a s the diode such as protection chip, rectifier, switching and so on. 3. others 3-1. surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (am monia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optic al characteristics changes (light intensity, chrominan ce) and change in quality of die bonding (ag-paste) materials. all of the above will cause function failure of the products. therefore, please pay attention to the storage envi ronment for mounted product (concern the generated gas of the surrounding parts of the products and the atmos pheric environment). downloaded from: http:///
www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet 201 6 .0 3 - rev. c sml-d14(a) series 7/8 3-2. electrostatic damage the product is part of semiconductor and electrosta tic sensitive, there s high possibility to be damaged by the electrostatic discharge. please take appropriate me asures to avoid the static electricity from human b ody and earthing of production equipment. the resistance va lues of electrostatic discharge (actual values) var y with products, therefore, please call our sales s taffs for inquiries. 3-3. electromagnetic wave please concern the influence on led in case of application with strong electromagnetic wave such as ih (induction heating). 4.mounting 4-1. soldering ? no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the product s reliability. ? the product is not for flow soldering. ? do not expose the product in the environment of high temperature (over 100oc ) or rapid temperature shift (within 3oc of temperature gradient) during the flow soldering of surrounding parts. ? please set appropriate reflow temperature based on our product usage conditions and specification. ? the max for reflow ing is 2 times, please finish the second flow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. ? compare with n2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. ? for our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into led. thus, there's high possibility that will influence its reliability. therefore, please be informed, concerning it before using it. 4-2. automatic mounting 4-2-1.silicon resin sealing product t he sea ling resin of led is very soft, so please select ad sorption nozzle that would not apply stress directl y on the sealing section. 4-2-2.mini package (smaller than 1608 size) vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to ? set magnet on parts feeder cassette of the mounter to control the product stabilization ? set ionizer to prevent electrostatic charge 4-3. mounting location the str ess like bending stress of circuit board dividing a fter mounting, may cause led package crack or damage of led internal junction, therefore, please concern the mounting direction and position to avoi d bending or screwing with great stress of the circuit board. . 4-4. mechanical stress after mounting the mechanical stress may damage the led after circ uit mounting, so please pay attention to the touch on product. stress strength according tothe mounting position: a>b> c>d downloaded from: http:///
www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet direction for circuit board warping 0.8mm 0.85mm 0.8mm 0.8m m 201 6 .0 3 - rev. c sml-d14(a) series 8/8 4-5. soldering pattern for recommendation we recommend the soldering pattern that shows on th e right. it will be different according to mounting situation of circu it board, therefore, please concern before designing. the product has adopted the electrode structure tha t it should solder with back electrode of the product. thus, please b e informed that the shape of electrode pin of solder fillet formation i s not guaranteed. 4-6. reflow profile for reflow profile, please refer to the conditions bel ow:( ) ? meaning of marks, conditions mark meanings conditions ts max maximum of pre-heating temperature 180oc ts min minimum of pre-heating temperature 140oc ts time from ts min to ts max over 60sec. t l reference temperature 230 to 260oc t l retention time for t l within 40sec. t p peak temperature 260oc(max) t p time for peak temperature within 10sec. t r / t temperature rising rate under 3oc/sec. t d / t temperature decreasing rate over -3oc/sec. above conditions are for reference. therefore, evaluate by customer s own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customer s own conditions. 4-7. cleaning after soldering please follow the conditions below if the cleaning is necessary after soldering. solvent we recommend to use alcohols solvent such as, isopropyl alcohols temperature under 30oc within 3 minutes ultrasonic cleaning 15w below 1 liter (capacity of tank) drying under 100oc within 3 minutes downloaded from: http:///
r1102 a www.rohm.com ? 2015 rohm co., ltd. all rights reserved. notice ro hm cu stome r s upport sy s tem h ttp :// www.r oh m .co m/ co n tact / thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. no tes the information contained herein is subject to change without notice. before you use our products, pl ease contact our sales representative and verify th e la tes t specifica - tion s : alt hou gh rohm is contin uous ly wor ki ng to im pr ove p ro du ct r eli a bility and qualit y, semicon - du c tor s c an bre a k d ow n and ma lf un ct io n du e to var io us f ac to rs. th e re fore, in or der to prevent pe r so nal in ju ry or fi re ar isi ng f ro m fa ilur e, please ta ke sa f ety mea s ur es su ch as com plyin g wi th th e de r at in g ch ara ct er ist ic s, impl e menting redundant and f ir e preve nt ion designs, and u tilizin g ba ck up s a nd f ail - sa fe p ro ce du re s. ro hm shall have no responsibility for any damages arising out of the use of our poducts b ey ond the rating specified by rohm. examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not gr ant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm or any other parties. rohm shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. the products are intended for use in general electronic equipment (i.e. av/oa devices, communi- cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. the products specified in this document are not designed to be radiation tolerant. for use of our products in applications requiring a high degree of reliability (as ex emplified bel ow), please contact and consult with a rohm representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. do not use our products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. rohm shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. rohm has used reasonable care to ensur the accuracy of the information contained in this document. however, rohm does not warrants that such information is error-free, and rohm shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. please use the products in accordance with any applicable environmental laws and regulations, such as the rohs directive. for more details, including rohs compatibility, please contact a rohm sales office. rohm shall have no responsibility for an y damages or losses resulting non-compliance with any applicable laws or regulations. when providing our products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the us export administration regulations and the foreign exchange and foreign trade act. this document, in part or in whole, may not be reprinted or reproduced without prior consent of rohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10)11) 12) 13) 14) downloaded from: http:///
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